Self-aligned Assembly Technology For Optical Devices Using AuSn Solder Bumps Flip-chip Bonding
- 24 August 2005
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 260-261
- https://doi.org/10.1109/leos.1992.693942
Abstract
A flip-chip bonding technique using AuSn solder bumps, which are mechanically formed an the substrate, has been developed. Self-aligned assembly used in laser diode chip was realized with /spl plusmn/1/spl mu/m bonding Positioning precision.Keywords
This publication has 1 reference indexed in Scilit:
- Self-aligned flip-chip assembly of protonic devices with electrical and optical connectionsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1990