Thermal reaction of Ti evaporated on GaAs

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Abstract
The thermal reaction of a vacuum‐evaporated Ti film with substrate GaAs has been investigated using Auger electron spectroscopy and x‐ray diffractometry. As accumulation and Ga depletion at the Ti/GaAs interface and Ga pileup in front of the As‐rich layer have been observed. The As‐rich and the Ga‐rich layers have been found to be composed of TiAs/Ti5As3 and Ti2Ga3/Ti5Ga4, respectively. It has also been found that the rate of the Ti‐GaAs reaction is governed by the interdiffusion process of Ti and As at the interface with an activation energy of 1.70±0.05 eV. The low diffusivity and relatively high Schottky barrier height of the present system facilitate the formation of useful Schottky barrier junctions.