A modified reliability expression for the electromigration time-to-failure
- 1 January 1975
- journal article
- Published by Elsevier in Microelectronics Reliability
- Vol. 14 (5-6) , 431-433
- https://doi.org/10.1016/0026-2714(75)90152-3
Abstract
No abstract availableThis publication has 5 references indexed in Scilit:
- Electromigration Failure in A1 Thin Films under Constant and Reversed DC PoweringIEEE Transactions on Reliability, 1974
- Electromigration testing—A current problemMicroelectronics Reliability, 1974
- On the spread of time-to-failure measurements in thin metallic filmsThin Solid Films, 1973
- Electromigration and metalization lifetimesJournal of Applied Physics, 1973
- Current-induced marker motion in gold wiresJournal of Physics and Chemistry of Solids, 1961