On the spread of time-to-failure measurements in thin metallic films
- 1 July 1973
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 17 (1) , S13-S16
- https://doi.org/10.1016/0040-6090(73)90016-3
Abstract
No abstract availableThis publication has 5 references indexed in Scilit:
- Electromigration and crevice formation in thin metallic filmsThin Solid Films, 1972
- Electromigration in Al Films Containing SiApplied Physics Letters, 1971
- Dependence of Electromigration-Induced Failure Time on Length and Width of Aluminum Thin-Film ConductorsJournal of Applied Physics, 1970
- Electromigration Damage in Aluminum Film ConductorsJournal of Applied Physics, 1970
- Electromigration—A brief survey and some recent resultsIEEE Transactions on Electron Devices, 1969