RF-microwave multi-layer integrated passives using fully organic System on Package (SOP) technology
- 13 November 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 3, 1731-1734
- https://doi.org/10.1109/mwsym.2001.967240
Abstract
No abstract availableThis publication has 8 references indexed in Scilit:
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