HBT IC process with copper substrate
- 5 March 1998
- journal article
- Published by Institution of Engineering and Technology (IET) in Electronics Letters
- Vol. 34 (5) , 467-468
- https://doi.org/10.1049/el:19980372
Abstract
The authors have demonstrated a copper/polymer substrate HBT integrated circuit technology which offers a low loss microstrip transmission line environment, continuous back-side ground planes, and enhanced thermal performance.Keywords
This publication has 4 references indexed in Scilit:
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- A 277-GHz f/sub max/ transferred-substrate heterojunction bipolar transistorIEEE Electron Device Letters, 1997
- Low thermal impedance MMIC technologyIEEE Microwave and Guided Wave Letters, 1997
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