Molybdenum Film Formation by Low Pressure Chemical Vapor Deposition

Abstract
A new low pressure chemical vapor deposition apparatus for molybdenum film formation by the hydrogen reduction of molybdenum pentachloride is developed. The apparatus realizes the uniformity of film thickness within ±5% for 25 wafers per batch and molybdenum film formation without oxidation. It is found that the deposition rate is controlled by surface reaction up to a higher temperature than that under atmospheric pressure and is proportional to the 3/2 power of hydrogen partial pressure in the region of surface reaction.

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