Residual stress behaviour of isomeric PMDA-ODA polyimides
- 1 January 1992
- Vol. 33 (6) , 1228-1236
- https://doi.org/10.1016/0032-3861(92)90768-r
Abstract
No abstract availableKeywords
This publication has 10 references indexed in Scilit:
- X‐ray determination of encapsulation stresses on silicon wafersPolymer Engineering & Science, 1988
- Adhesion and interface investigation of polyimide on metalsJournal of Adhesion Science and Technology, 1988
- Re-examination of the relationship between packing coefficient and thermal expansion coefficient for aromatic polyimidesPolymer, 1987
- Molecular order in condensed states of semiflexible poly(amic acid) and polyimideMacromolecules, 1984
- Measurement of stresses generated in cured polyimide filmsJournal of Vacuum Science & Technology A, 1983
- Generalized formula for curvature radius and layer stresses caused by thermal strain in semiconductor multilayer structuresJournal of Applied Physics, 1983
- PolyimidesJournal of Polymer Science: Macromolecular Reviews, 1976
- Measurement of Strains at Si-SiO2 InterfaceJournal of Applied Physics, 1966
- Young's Modulus, Shear Modulus, and Poisson's Ratio in Silicon and GermaniumJournal of Applied Physics, 1965
- Analysis of Bi-Metal ThermostatsJournal of the Optical Society of America, 1925