Influence of temperature, humidity, and defect location on delamination in plastic IC packages
- 1 January 1999
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components and Packaging Technologies
- Vol. 22 (4) , 512-518
- https://doi.org/10.1109/6144.814966
Abstract
No abstract availableThis publication has 16 references indexed in Scilit:
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