Towards Low Cost High Density Bumping
- 24 August 2005
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 11 references indexed in Scilit:
- Electroless deposition of bumps for TAB technologyPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Development of a Cost‐effective and Flexible Bumping Method for Flip‐chip InterconnectionsMicroelectronics International, 1992
- Autocatalytic Electroless Gold Deposition Using Hydrazine and Dimethylamine Borane as Reducing AgentsJournal of the Electrochemical Society, 1991
- Surface pretreatments of aluminium for electroplatingSurface and Coatings Technology, 1988
- Electroless tin plating. Plating through disproportionation from Sn (II)-NaOH solution.Journal of the Metal Finishing Society of Japan, 1987
- Packaging of Dot‐matrix Electroluminescent Display ModuleMicroelectronics International, 1985
- A review of electroless gold deposition processesGold Bulletin, 1984
- Electroless Gold Beam Lead PlatingJournal of the Electrochemical Society, 1974
- Some Practical Aspects of Electroless Gold PlatingJournal of the Electrochemical Society, 1974
- An Electrochemical Study of Electroless Gold-Deposition ReactionJournal of the Electrochemical Society, 1973