Solid state intermetallic compound layer growth between copper and hot dipped indium coatings
- 1 October 1995
- journal article
- Published by Springer Nature in Journal of Materials Science
- Vol. 30 (19) , 4871-4878
- https://doi.org/10.1007/bf01154497
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
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- Intermetallic growth and mechanical behavior of low and high melting temperature solder alloysMetallurgical and Materials Transactions A, 1994
- Phase equilibria of the cu-in system II: Thermodynamic assessment and calculation of phase diagramJournal of Phase Equilibria and Diffusion, 1993
- Interdiffusion Between in Layer and Bulk Cu or Cu-In AlloyPhysica Status Solidi (a), 1990