Flip-chip on FR-4 integrated circuit packaging
- 30 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 182-186
- https://doi.org/10.1109/ectc.1993.346722
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
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- 3-D electromagnetic field analysis of interconnections in copper-polyimide multichip modulesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1991
- Chip-to-Package InterconnectionsPublished by Springer Nature ,1989
- Reliability of Controlled Collapse InterconnectionsIBM Journal of Research and Development, 1969