Effect of angle of incidence during deposition on Ti-Pd-Au conductor film adhesion
- 1 February 1977
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 41 (1) , 87-103
- https://doi.org/10.1016/0040-6090(77)90012-8
Abstract
No abstract availableThis publication has 13 references indexed in Scilit:
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