Observations on the aging of Ti-based metallizations in air/HCl environments
- 1 March 1973
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 15 (3) , 325-353
- https://doi.org/10.1016/0040-6090(73)90188-0
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Stability of conductor metallizations in corrosive environmentsJournal of Electronic Materials, 1972
- Aluminum beam leaded chips, substrates and crossovers: A single metal systemMetallurgical Transactions, 1971
- Adhesion Mechanism of Gold-Underlayer Film Combinations to Oxide SubstratesJournal of Vacuum Science and Technology, 1969
- The Influence of Noble Metal Alloy Additions on the Electrochemical and Corrosion Behavior of TitaniumJournal of the Electrochemical Society, 1959