Boron penetration studies from p+ polycrystalline Si through HfSixOy

Abstract
We present detailed B penetration studies from B-doped polysilicon through alternate gate dielectric candidate HfSi x O y films. No detectible B penetration is observed for annealing times as long as 20 s after 950 ° C . Considerable B incorporation into the Si substrate is observed for annealing temperatures higher than 950 ° C . By modeling the B depth profiles, we calculated the B diffusivities through HfSi x O y to be higher than the corresponding diffusivities for SiO 2 . B diffusion through grain boundaries after HfSi x O y crystallization is proposed to be responsible for the enhanced B diffusivity observed.

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