High resolution studies of crystalline damage induced by lapping and single-point diamond machining of Si(100)
- 1 May 1996
- journal article
- Published by Springer Nature in Journal of Materials Research
- Vol. 11 (5) , 1228-1237
- https://doi.org/10.1557/jmr.1996.0157
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
- Ductile-regime machining model for diamond turning of brittle materialsPrecision Engineering, 1991
- Crystal Orientation Dependence of Machning Damage–A Stress ModelJournal of the American Ceramic Society, 1990
- Ductile‐Regime Machining of Germanium and SiliconJournal of the American Ceramic Society, 1990
- Surface Defects in Polished Silicon Studied by Cross‐Sectional Transmission Electron MicroscopyJournal of the American Ceramic Society, 1989
- Ductile-Regime Grinding Of Brittle Materials: Experimental Results And The Development Of A ModelPublished by SPIE-Intl Soc Optical Eng ,1989
- Contact Damage in Single‐Crystalline Silicon Investigated by Cross‐Sectional Transmission Electron MicroscopyJournal of the American Ceramic Society, 1988