Fabrication and packaging of high-density multichip interconnect (HDMI) substrates
- 13 January 2003
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- Recent Advances in Thin Film Multilayer Interconnect Technology for IC PackagingMRS Proceedings, 1987