Recent Advances in Thin Film Multilayer Interconnect Technology for IC Packaging
- 1 January 1987
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Laser Chemical Vapor Deposition of Gold: The Effect of Organometallic StructureJournal of the Electrochemical Society, 1987
- Polyimides as Interlayer Dielectrics for High-Performance Interconnections of Integrated CircuitsPublished by American Chemical Society (ACS) ,1987
- Multilevel interconnections for wafer scale integrationJournal of Vacuum Science & Technology A, 1986
- Laser ablation of polymersJournal of Vacuum Science & Technology A, 1986
- Packaging Technology for the NEC SX SupercomputerIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1985