Interdiffusion and formation of intermetallic compounds in tin-copper alloy surface coatings
- 1 January 1977
- journal article
- Published by Elsevier in Surface Technology
- Vol. 5 (1) , 57-63
- https://doi.org/10.1016/0376-4583(77)90041-3
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Intermetallic Growth and Contact Resistance of Tin Contacts After AgingIEEE Transactions on Parts, Hybrids, and Packaging, 1976
- Special aspects of diffusion in thin filmsThin Solid Films, 1975
- Interdiffusion and reaction in bimetallic Cu-Sn thin filmsActa Metallurgica, 1973
- A Preliminary Report on Growth of Compound Layers on Various Metal Bases Plated with Tin and its AlloysTransactions of the IMF, 1973