Frameworks for direct bonding
- 31 December 1995
- journal article
- Published by Elsevier in Philips Journal of Research
- Vol. 49 (1-2) , 11-21
- https://doi.org/10.1016/0165-5817(95)82001-9
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Surface preparation and phenomenological aspects of direct bondingPhilips Journal of Research, 1995
- Silicon-on-Insulator Wafer Bonding-Wafer Thinning Technological EvaluationsJapanese Journal of Applied Physics, 1989