An analysis of tungsten probes' effect on yield in a production wafer probe environment

Publisher Website

13 January 2003

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

https://doi.org/10.1109/test.1989.82296

Abstract

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Keywords

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Dual-Mode Electrical-Optical Flip-Chip I/O Interconnects and a Compatible Probe Substrate for Wafer-Level Testing
Published by Institute of Electrical and Electronics Engineers (IEEE) ,2006