Dual-Mode Electrical-Optical Flip-Chip I/O Interconnects and a Compatible Probe Substrate for Wafer-Level Testing
- 10 July 2006
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- No. 05695503,p. 768-775
- https://doi.org/10.1109/ectc.2006.1645744
Abstract
We describe low cost compatible electrical and optical flip-chip I/O interconnects to leverage the performance requirements of future high-performance chips. Metal-clad polymer pins are fabricated and assembled to demonstrate chip-to-substrate electrical and optical interconnection. In order to address the complexity of wafer-level testing, a probe substrate designed to interface with the metal-clad polymer pin I/O interconnects is fabricated and demonstrated. The demonstration of these two distinct, yet highly related, advances (novel I/O and compatible probe substrate) addresses some of the key daunting problems facing the semiconductor industryKeywords
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