Sea of polymer pillars: compliant wafer-level electrical-optical chip I/O interconnections
- 27 October 2003
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Photonics Technology Letters
- Vol. 15 (11) , 1567-1569
- https://doi.org/10.1109/lpt.2003.818651
Abstract
An electrical-optical chip input-output (I/O) interconnection technology called sea of polymer pillars (SoPP) is presented. SoPP provides highly process-integrated and mechanically flexible (compliant) electrical-optical die-to-board interconnections that mitigate thermo-mechanical expansion mismatches. The I/O density of SoPP exceeds 10/sup 5//cm/sup 2/. The compliance of the polymer pillars is shown to be 3-5 /spl mu/m/mN. Approximately 50% input optical coupling efficiency into a volume grating coupler through a set of polymer pillars is demonstrated.Keywords
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