Sea of dual mode polymer pillar I/O interconnections for gigascale integration
- 22 December 2003
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Sea of leads ultra high-density compliant wafer-level packaging technologyPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- The evolution of monolithic and polylithic interconnect technologyPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003