Failure mechanism models for brittle fracture
- 1 January 1992
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Reliability
- Vol. 41 (3) , 328-335
- https://doi.org/10.1109/24.159794
Abstract
No abstract availableThis publication has 5 references indexed in Scilit:
- Failure mechanism models for plastic deformationIEEE Transactions on Reliability, 1992
- Failure-mechanism models for excessive elastic deformationIEEE Transactions on Reliability, 1992
- Temperature Dependence of the Mechanical Properties of GaAs WafersJournal of Electronic Packaging, 1991
- Material failure mechanisms and damage modelsIEEE Transactions on Reliability, 1991
- Horizontal Die Cracking as a Yield and Reliability Problem in Integrated Circuit DevicesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987