Dielectric and Temperature Measurements During Microwave Curing of Epoxy in a Sweeping Resonant Cavity
- 1 January 1987
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 1 (0149645X) , 465-468
- https://doi.org/10.1109/mwsym.1987.1132433
Abstract
A TM/sub 012/ -mode cylindrical cavity was mechanically critically couple with a microwave circuit at 3.2 GHz. A fluoroptic temperature sensing device was used to monitor temperature in the microwave environment. Stoichiometric mixtures of epoxy (DER 332) and amine (DDS) were heated in this sweeping resonant cavity for curing times of 10 and 30 minutes, respectively. On-line temperature and dielectric properties versus time profiles were measured during the curing process. The dielectric properties versus temperature also measured during cooling. Thereafter, extent of cure of epoxy was determined Differential Scanning Calorimeter.Keywords
This publication has 7 references indexed in Scilit:
- Which Biopsy Method Is More Suitable Between a Basin Dissection and Pick-Up Biopsy for Sentinel Nodes in Laparoscopic Sentinel-Node Navigation Surgery (LSNNS) for Gastric Cancer?Journal of Laparoendoscopic & Advanced Surgical Techniques, 2008
- PC-Based Monitoring and Control System for Microwave Curing of Polymer CompositesMaterials and Manufacturing Processes, 1994
- Effects of stoichiometric mixing ratio on epoxy cure—a dielectric analysisPolymer Engineering & Science, 1986
- Chemical interpretation of the relaxed permittivity during epoxy resin curePolymer Engineering & Science, 1986
- Dielectric modeling of the curing processPolymer Engineering & Science, 1986
- Dynamic dielectric analysis: Nondestructive material evaluation and cure cycle monitoringPolymer Engineering & Science, 1986
- Use of cotinuous and pul sed microwaves for quick polymerization of epoxy resins: study of some thermomechanical propertiesThermochimica Acta, 1985