Multilevel planarized-trench-aluminum (PTA) interconnection using reflow sputtering and chemical mechanical polishing
- 30 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 285-288
- https://doi.org/10.1109/iedm.1993.347240
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- A new abrasive-free, chemical-mechanical-polishing technique for aluminum metallization of ULSI devicesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1992
- A quarter-micron planarized interconnection technology with self-aligned plugPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1992