Effect of aging on the microstructure and shear strength of SnPbAg/Ni-P/Cu and SnAg/Ni-P/Cu solder joints
- 1 September 2000
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 29 (9) , 1105-1109
- https://doi.org/10.1007/s11664-004-0272-x
Abstract
No abstract availableKeywords
This publication has 10 references indexed in Scilit:
- The interaction kinetics and compound formation between electroless NiP and solderThin Solid Films, 1994
- Lead (Pb)-free solders for electronic packagingJournal of Electronic Materials, 1994
- Materials interaction in PbSn/NiP/Al and PbSn/NiB/Al solder bumps on chipsThin Solid Films, 1993
- Strength of tin-based soldered jointsJournal of Materials Science, 1992
- Solder bumper formation using electroless plating and ultrasonic solderingIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1990
- Solder Joint Reliability—Can Solder Creep?Soldering & Surface Mount Technology, 1990
- The Crystallization of an Electroless Ni‐P DepositJournal of the Electrochemical Society, 1989
- Kinetics of intermetallic compound growth between nickel, electroless, Ni-P, electroless Ni-B and tin at 453 to 493 KJournal of Materials Science, 1987
- Solder Connections with a Ni BarrierIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1986
- The Structure and Mechanical Properties of Electroless NickelJournal of the Electrochemical Society, 1965