Strength of tin-based soldered joints
- 1 January 1992
- journal article
- Published by Springer Nature in Journal of Materials Science
- Vol. 27 (21) , 5777-5782
- https://doi.org/10.1007/bf01119737
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Solder Joint Reliability—Can Solder Creep?Soldering & Surface Mount Technology, 1990
- Mechanical behaviors of 60/40 tin-lead solder lap jointsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1989
- Effects of intermetallic formation at the interface between copper and lead-tin solderJournal of Materials Science, 1988
- The strength of brass/Sn-Pb-Sb solder joints containing 0 to 10% SbJournal of Materials Science, 1986