Mechanical behaviors of 60/40 tin-lead solder lap joints
- 1 January 1989
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 12 (4) , 459-468
- https://doi.org/10.1109/33.49002
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- Fatigue of 60/40 SolderIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1986
- Deformation Modeling Applied to Stress Relaxation of Four Solder AlloysJournal of Engineering Materials and Technology, 1980
- Mechanical Properties of Cast Tin-Lead SolderJournal of Testing and Evaluation, 1974