Electromigration failure of contacts and vias in sub-micron integrated circuit metallizations
- 1 July 1996
- journal article
- Published by Elsevier in Microelectronics Reliability
- Vol. 36 (7-8) , 925-953
- https://doi.org/10.1016/0026-2714(96)00102-3
Abstract
No abstract availableThis publication has 19 references indexed in Scilit:
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