Copper interconnections and reliability
- 1 January 1998
- journal article
- review article
- Published by Elsevier in Materials Chemistry and Physics
- Vol. 52 (1) , 5-16
- https://doi.org/10.1016/s0254-0584(98)80000-x
Abstract
No abstract availableKeywords
This publication has 37 references indexed in Scilit:
- The Effect of Adding Hexafluoroacetylacetone on Chemical Vapor Deposition of Copper Using Cu(I) and Cu(II) Precursor SystemsJournal of the Electrochemical Society, 1995
- VLSI on-chip interconnection performance simulations and measurementsIBM Journal of Research and Development, 1995
- Copper interconnection integration and reliabilityThin Solid Films, 1995
- Electromigration in two-level interconnects of Cu and Al alloysMaterials Chemistry and Physics, 1995
- Electromigration failure mechanisms in bamboo-grained Al(Cu) interconnectionsThin Solid Films, 1995
- Materials Issues in Copper InterconnectionsMRS Bulletin, 1994
- Crystallographic texture change during abnormal grain growth in Cu-Co thin filmsApplied Physics Letters, 1994
- Texture and microstructure of thin copper filmsJournal of Electronic Materials, 1993
- On-chip wiring for VLSI: Status and directionsIBM Journal of Research and Development, 1990
- The development of grain structure during growth of metallic filmsActa Metallurgica, 1984