Electromigration failure mechanisms in bamboo-grained Al(Cu) interconnections
- 1 May 1995
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 260 (1) , 124-134
- https://doi.org/10.1016/0040-6090(94)06484-9
Abstract
No abstract availableThis publication has 27 references indexed in Scilit:
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