η-Cu6Sn5 precipitates in solder joints
- 1 October 1991
- journal article
- Published by Elsevier in Scripta Metallurgica et Materialia
- Vol. 25 (10) , 2329-2333
- https://doi.org/10.1016/0956-716x(91)90024-u
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- Effects of intermetallic formation at the interface between copper and lead-tin solderJournal of Materials Science, 1988
- The effect of Cu6Sn5 whisker precipitates in bulk 60sn-40pb solderJournal of Electronic Materials, 1987