Phase coarsening and crack growth rate during thermo-mechanical cycling of 63Sn37Pb solder joints
- 1 August 1998
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 27 (8) , 941-947
- https://doi.org/10.1007/s11664-998-0125-0
Abstract
No abstract availableKeywords
This publication has 8 references indexed in Scilit:
- Effect of Microstructure Size on Deformation Kinetics and Thermo-Mechanical Fatigue of 63Sn37Pb Solder JointsJournal of Electronic Packaging, 1996
- Fatigue Crack Growth Rate in 63Sn37Pb Solder JointsJournal of Electronic Packaging, 1993
- Computer Simulation of Thermo-Mechanical Fatigue of Solder Joints Including Microstructure CoarseningJournal of Electronic Packaging, 1993
- Thermomechanical Fatigue of 63Sn-37Pb Solder JointsPublished by Springer Nature ,1993
- Modeling of the Thermomechanical Fatigue of 63Sn-37Pb AlloyPublished by ASTM International ,1993
- Grain growth in a superplastic Zn-22% Al alloyActa Metallurgica, 1986
- Messung der Korngrenzenselbstdiffusion in polykristallinem ZinnPhysica Status Solidi (b), 1962
- Self-diffusion in leadActa Metallurgica, 1954