Thermomechanical Fatigue of 63Sn-37Pb Solder Joints
- 1 January 1993
- book chapter
- Published by Springer Nature
Abstract
No abstract availableKeywords
This publication has 21 references indexed in Scilit:
- Fatigue Lives on 60Sn/40Pb Solder Joints Made With Different Cooling RatesJournal of Electronic Packaging, 1992
- The Role of Microstructure in Thermal Fatigue of Pb-Sn Solder JointsPublished by Springer Nature ,1991
- Surface Mount Attachment Reliability and Figures of Merit for Design for ReliabilityPublished by Springer Nature ,1991
- Solder Attachment Reliability, Accelerated Testing, and Result EvaluationPublished by Springer Nature ,1991
- Integrated Matrix Creep: Application to Accelerated Testing and Lifetime PredictionPublished by Springer Nature ,1991
- Predicting Thermal and Mechanical Fatigue Lives from Isothermal Low Cycle DataPublished by Springer Nature ,1991
- A Damage Integral Methodology for Thermal and Mechanical Fatigue of Solder JointsPublished by Springer Nature ,1991
- Creep and Stress Relaxation in Solder JointsPublished by Springer Nature ,1991
- A damage integral approach to thermal fatigue of solder jointsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1989
- Fatigue of Solder Joints in Surface Mount DevicesPublished by ASTM International ,1988