Surface Mount Attachment Reliability and Figures of Merit for Design for Reliability
- 1 January 1991
- book chapter
- Published by Springer Nature
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Reliability figures of merit for surface-soldered leadless chip carriers compared to lead packagesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1989
- Creep and Stress Relaxation in Solder Joints of Surface-Mounted Chip CarriersIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987
- The IEEE Compliant Lead Task ForceIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987
- Forces, Moments, and Displacements During Thermal Chamber Cycling of Leadless Ceramic Chip Carriers Soldered to Printed BoardsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1984
- Fatigue Life of Leadless Chip Carrier Solder Joints During Power CyclingIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983