Reliability figures of merit for surface-soldered leadless chip carriers compared to lead packages
- 1 January 1989
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 12 (4) , 449-458
- https://doi.org/10.1109/33.49001
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
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- The IEEE Compliant Lead Task ForceIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987
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- Fatigue Life of Leadless Chip Carrier Solder Joints During Power CyclingIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983
- Thermal Stress and Low Cycle FatigueJournal of Applied Mechanics, 1966