Electron mobility in multi-FinFET with a (111) channel surface fabricated by orientation-dependent wet etching
- 17 June 2005
- journal article
- Published by Elsevier in Microelectronic Engineering
- Vol. 80, 390-393
- https://doi.org/10.1016/j.mee.2005.04.014
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- A Highly Threshold Voltage-Controllable 4T FinFET with an 8.5-nm-Thick Si-Fin ChannelIEEE Electron Device Letters, 2004
- Ideal rectangular cross-section Si-Fin channel double-gate MOSFETs fabricated using orientation-dependent wet etchingIEEE Electron Device Letters, 2003
- On the universality of inversion layer mobility in Si MOSFET's: Part II-effects of surface orientationIEEE Transactions on Electron Devices, 1994
- Calculated threshold-voltage characteristics of an XMOS transistor having an additional bottom gateSolid-State Electronics, 1984