Healing of voids in the aluminum metallization of integrated circuit chips
- 1 January 1990
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Reliability
- Vol. 39 (5) , 564-570
- https://doi.org/10.1109/24.61312
Abstract
No abstract availableThis publication has 13 references indexed in Scilit:
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