Stresses in Adhesively Bonded Bi-Material Assemblies Used in Electronic Packaging
- 1 January 1986
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
The magnitude and the distribution of stresses in elongated adhesively bonded bi-material assemblies subjected to uniform heating or cooling are determined and discussed. The suggested approach enables one to evaluate the stresses in the assembly components themselves, as well as the shearing and normal (peeling) stresses in the interface, with consideration of the attachment compliance. The case of an epoxy bonded assembly is used to illustrate the developed theory.Keywords
This publication has 2 references indexed in Scilit:
- Structured Copper: A Pliable High Conductance Material for Bonding to Silicon Power DevicesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983
- Analysis of Bi-Metal ThermostatsJournal of the Optical Society of America, 1925