3D interconnection for ultra-dense multichip modules
- 4 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 540-547
- https://doi.org/10.1109/ectc.1990.122240
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
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- Silicon-On-Silicon PackagingIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1984
- Placement and average interconnection lengths of computer logicIEEE Transactions on Circuits and Systems, 1979
- On a Pin Versus Block Relationship For Partitions of Logic GraphsIEEE Transactions on Computers, 1971