Effects of solder alloy constitutive relationships on impact force responses of package-level solder joints under ball impact test
- 1 October 2006
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 35 (10) , 1892-1901
- https://doi.org/10.1007/s11664-006-0173-2
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- The mechanics of the solder ball shear test and the effect of shear rateMaterials Science and Engineering: A, 2006
- Transient fracturing of solder joints subjected to displacement-controlled impact loadsMicroelectronics Reliability, 2005
- Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test conditionMicroelectronics Reliability, 2005
- Ductile-to-brittle transition in Sn–Zn solder joints measured by impact testScripta Materialia, 2004
- Package to Board Interconnection Shear Strength (PBISS): Effect of Surface Finish, PWB Build-Up Layer and Chip Scale Package StructureIEEE Transactions on Components and Packaging Technologies, 2004