Computer simulation of thick resistive films as two component percolation systems: Segregation of the conducting component
- 16 August 1985
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 130 (1-2) , 1-15
- https://doi.org/10.1016/0040-6090(85)90290-1
Abstract
No abstract availableKeywords
This publication has 16 references indexed in Scilit:
- A Simulative Approach to Electron Conduction in Thick‐Film ResistorsActive and Passive Electronic Components, 1983
- Particle size effects in thick film resistorsJournal of Applied Physics, 1982
- A percolation model of conduction in segregated systems of metallic and insulating materials: application to thick film resistorsJournal of Physics D: Applied Physics, 1981
- Conduction mechanisms and 1/f noise in thick-film resistors with Pb3Rh7O15and Pb 2Ru2O7Journal of Applied Physics, 1981
- Electrical properties and conduction mechanisms of Ru-based thick-film (cermet) resistorsJournal of Applied Physics, 1977
- Influence of particle size ratio on the continuity of aggregatesJournal of Applied Physics, 1977
- Chains of conducting particles that determine the resistivity of thick resistive filmsThin Solid Films, 1977
- On the structure and conduction mechanism of thick resistive filmsThin Solid Films, 1976
- Electrical Conduction by Percolation in Thick Film ResistorsActive and Passive Electronic Components, 1976
- Influence of Particle Size on the Electrical Resistivity of Compacted Mixtures of Polymeric and Metallic PowdersJournal of Applied Physics, 1971