Thermodynamics of the Sn-In-Ag solder system
- 1 March 1998
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 27 (3) , 149-158
- https://doi.org/10.1007/s11664-998-0205-1
Abstract
No abstract availableKeywords
This publication has 26 references indexed in Scilit:
- A thermodynamic evaluation of the Ag-Sn systemPublished by Elsevier ,2001
- Fine Pitch Surface Mount Technology Assembly with Lead‐free, Low Residue Solder PasteSoldering & Surface Mount Technology, 1995
- On the Sn-Bi-Ag ternary phase diagramJournal of Electronic Materials, 1994
- SGTE data for pure elementsCalphad, 1991
- Thermodynamic Study of Liquid Ag–In and Ag–Ga Alloys with a Knudsen Cell-Mass SpectrometerMaterials Transactions, JIM, 1989
- The Ag-Sn (Silver-Tin) systemBulletin of Alloy Phase Diagrams, 1987
- The In−Pb (Indium-Lead) systemBulletin of Alloy Phase Diagrams, 1987
- The mechanical properties and microstructures of copper and brass joints soldered with eutectic tin-bismuth solderJournal of Materials Science, 1987
- Thermodynamic Studies on Liquid Silver-Indium AlloysTransactions of the Japan Institute of Metals, 1966
- Die Mischungswärmen in den binären Systemen des Indiums und Thalliums mit Zinn und BleiZeitschrift für Physikalische Chemie, 1961