A parametric study of flip chip reliability based on solder fatigue modelling

Publisher Website

22 November 2002

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

https://doi.org/10.1109/iemt.1997.626935

Abstract

No abstract available

Keywords

This publication has 2 references indexed in Scilit:

Thermal fatigue reliability enhancement of plastic ball grid array (PBGA) packages
Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
A creep-rupture model for two-phase eutectic solders
IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1988