Thermal fatigue reliability enhancement of plastic ball grid array (PBGA) packages
- 23 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 1211-1216
- https://doi.org/10.1109/ectc.1996.550889
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
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- Three-Dimensional Creep Analysis of Solder Joints in Surface Mount DevicesJournal of Electronic Packaging, 1995
- A creep-rupture model for two-phase eutectic soldersIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1988
- Fatigue of Solder Joints in Surface Mount DevicesPublished by ASTM International ,1988