Quantitative prediction of aging effects in plated wires
- 1 September 1969
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Magnetics
- Vol. 5 (3) , 495-500
- https://doi.org/10.1109/tmag.1969.1066606
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
- Life Expectancy of Plated Wire MemoriesJournal of Applied Physics, 1969
- Electrodeposited Cylindrical Magnetic FilmsJournal of Applied Physics, 1969
- Step Stress Aging of Plated Wire MemoriesBell System Technical Journal, 1968
- Aging and Skew in Permalloy-Base Magnetic FilmsJournal of Applied Physics, 1967
- A 500-nanosecond main computer memory utilizing plated-wire elementsPublished by Association for Computing Machinery (ACM) ,1966
- Measurements of skew, dispersion, and creep in plated wiresIEEE Transactions on Communication and Electronics, 1964