Mechanical response of PCBs in portable electronic products during drop impact
- 27 August 2003
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Effect of circuit board flexure on flip chips before underfillPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Effect of the drop impact on BGA/CSP package reliabilityMicroelectronics Reliability, 2002