Effect of the drop impact on BGA/CSP package reliability
- 1 January 2002
- journal article
- Published by Elsevier in Microelectronics Reliability
- Vol. 42 (1) , 77-82
- https://doi.org/10.1016/s0026-2714(01)00230-x
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- Trend of BGACSPKGD. The Reliability for .MU.BGA.Journal of The Japan Institute of Electronics Packaging, 1998
- Trend of BGACSPKGD. Board Assembly Technology and Reliability of D2BGA CSP.Journal of The Japan Institute of Electronics Packaging, 1998
- Effects of BGA Solder Geometry on Fatigue Life and Reliability Assessment.Journal of The Japan Institute of Electronics Packaging, 1998